{
    "@context": "https://id.ndl.go.jp/auth/context.json",
    "uri": "http://id.ndl.go.jp/auth/ndlna/01025442",
    "primaryTopic": {
        "uri": "http://id.ndl.go.jp/auth/entity/01025442",
        "type": {
            "uri": "http://xmlns.com/foaf/0.1/Person"
        },
        "name": "E. Jan Vardaman",
        "biographicalInformation": [
            "テックサーチ・インターナショナル社長"
        ]
    },
    "type": {
        "uri": "http://www.w3.org/2004/02/skos/core#Concept"
    },
    "modified": "2006-01-18T16:20:46",
    "created": "2006-01-17",
    "prefLabel": {
        "literalForm": "Vardaman, E. Jan"
    },
    "label": "Vardaman, E. Jan",
    "altLabel": [
        {
            "literalForm": "ヴァーダマン, E. ジャン"
        },
        {
            "literalForm": "Vardaman, Jan"
        }
    ],
    "source": [
        "よくわかる半導体パッケージのできるまで / 沼倉研史, E. Jan Vardaman 著",
        "LC典拠 (200601)"
    ],
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}