インプロセスモニタリングを用いたCO₂レーザによるVIAホールの高信頼加工技術
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- Material Type
- 記事
- Author/Editor
- 田中 健一郎久保 雅男内田 雄一 他
- Alternative Title
- Highly Reliable C0₂ Laser VIA Hole Drilling Technology by In-site Process Monitoring
- Periodical title
- エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
- No. or year of volume/issue
- 15(1)=98:2012.1
- Volume
- 15
- Issue
- 1
- Sequential issue number
- 98