鉛フリー無電解Niめっき皮膜中の共析物がはんだ実装信頼性に及ぼす影響
Digital data available（Japan Link Center）
Begin reading now
CiNii Research
Holdings of Libraries in Japan
This page shows libraries in Japan other than the National Diet Library that hold the material.
Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.
other
CiNii Research
Search ServiceDigitalYou can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Bibliographic Record
You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.
- Material Type
- 記事
- Author/Editor
- 土田 徹勇起大久保 利一狩野 貴宏 他
- Alternative Title
- The Influence of Incorporated Additives in Lead-Free Electroless Nickel Plating Film on the Reliability of Solder Joint
- Periodical title
- エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
- No. or year of volume/issue
- 16(6)=110:2013.9
- Volume
- 16
- Issue
- 6
- Sequential issue number
- 110