平成27年技術賞受賞...

平成27年技術賞受賞講演 微量元素を添加したSnAgCu系鉛フリーはんだの産業電子機器への適用に関する開発

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平成27年技術賞受賞講演 微量元素を添加したSnAgCu系鉛フリーはんだの産業電子機器への適用に関する開発

Call No. (NDL)
Z74-B258
Bibliographic ID of National Diet Library
027628355
Material type
記事
Author
渡邉 裕彦ほか
Publisher
東京 : エレクトロニクス実装学会
Publication date
2016-09
Material Format
Paper
Journal name
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 19(6)=131:2016.9
Publication Page
p.427-434
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Paper Digital

Material Type
記事
Author/Editor
渡邉 裕彦
浅井 竜彦
外薗 洋昭
齋藤 俊介
Alternative Title
Development on the Application of the SnAgCu Based Lead-Free Solder a Small Amount of the Added 5 Elements Solder of Industrial Electronic Equipment
Periodical title
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue
19(6)=131:2016.9
Volume
19
Issue
6
Sequential issue number
131