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Bibliographic Record
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- Material Type
- 記事
- Author/Editor
- 梅田 泰野村 太郎中川 陽代中林 祐稀田代 雄彦本間 英夫高井 治
- Alternative Title
- High Adhesion Plating Process for ABS Resin using Ultrafine Bubble with Low Ozonated Water
- Periodical title
- エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
- No. or year of volume/issue
- 19(7)=132:2016.11
- Volume
- 19
- Issue
- 7
- Sequential issue number
- 132