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ウルトラファインバブルと低濃度オゾン水を使用したABS樹脂の高密着めっき法

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ウルトラファインバブルと低濃度オゾン水を使用したABS樹脂の高密着めっき法

Call No. (NDL)
Z74-B258
Bibliographic ID of National Diet Library
027746245
Material type
記事
Author
梅田 泰ほか
Publisher
東京 : エレクトロニクス実装学会
Publication date
2016-11
Material Format
Paper
Journal name
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 19(7)=132:2016.11
Publication Page
p.492-500
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Paper Digital

Material Type
記事
Author/Editor
梅田 泰
野村 太郎
中川 陽代
中林 祐稀
田代 雄彦
本間 英夫
高井 治
Alternative Title
High Adhesion Plating Process for ABS Resin using Ultrafine Bubble with Low Ozonated Water
Periodical title
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue
19(7)=132:2016.11
Volume
19
Issue
7
Sequential issue number
132