Cu-Ni-Si合金板の強度と導電率に及ぼす極低温高速圧延の影響

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Cu-Ni-Si合金板の強度と導電率に及ぼす極低温高速圧延の影響

Call No. (NDL)
Z17-336
Bibliographic ID of National Diet Library
030594284
Material type
記事
Author
鞭目 龍之介ほか
Publisher
東京 : 日本伸銅協会
Publication date
2020
Material Format
Paper
Journal name
銅と銅合金 : 銅及び銅合金技術研究会誌 = Copper and copper alloy : journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies / 銅及び銅合金技術研究会 [編] 59(1):2020
Publication Page
p.213-218
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Material Type
記事
Author/Editor
鞭目 龍之介
李 相民
松本 良
宇都宮 裕
三原 邦照
藤原 英道
Alternative Title
Influence of Cryogenic High-Speed Rolling on Tensile Strength and Electric Conductivity of Cu-Ni-Si Alloy Sheet
Periodical title
銅と銅合金 : 銅及び銅合金技術研究会誌 = Copper and copper alloy : journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies / 銅及び銅合金技術研究会 [編]
No. or year of volume/issue
59(1):2020
Volume
59
Issue
1
Pages
213-218