Formation Mechanisms of Thermal Fatigue Crack Networks in Sn-Ag-Cu Die-attach Joint in High Speed Thermal Cycling (Mate2020特集号 : 第26回「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム)
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- Material Type
- 記事
- Author/Editor
- Hiroshige SUGIMOTOYoshiharu KARIYAYoshiki ABERyuichiro HANADAYoshinori YOKOYAMAShinnosuke SODA
- Author Heading
- Periodical title
- スマートプロセス学会誌 = Journal of smart processing
- No. or year of volume/issue
- 9(5):2020.9
- Volume
- 9
- Issue
- 5
- Pages
- 224-231