直接水冷型両面冷却パワーモジュールの高信頼実装技術
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- Material Type
- 記事
- Author/Editor
- 中津 欣也徳山 健樋熊 真人佐川 俊文椋野 秀樹
- Alternative Title
- High Reliability Packaging Technology of Direct Water Double Side Cooled Power Module
- Periodical title
- エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
- No. or year of volume/issue
- 24(1)=161:2021.1
- Volume
- 24
- Issue
- 1
- Sequential issue number
- 161