Au薄膜を介したCu電極の微細ピッチCoC(チップ・オン・チップ)実装技術開発
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- Material Type
- 記事
- Author/Editor
- 難波 兼二田子 雅基栗田 洋一郎 他
- Alternative Title
- Development of fine-pitch Chip-on-Chip (CoC) bonding technology with Cu electrode using thin Au film connection
- Periodical title
- マイクロエレクトロニクスシンポジウム論文集
- No. or year of volume/issue
- 18 2008.9.18・19
- Volume
- 18
- Pages
- 47～50
- Publication date of volume/issue (W3CDTF)
- 2008-09