マイクロメートルサイズの酸化銀粒子を用いた高温環境向け鉛フリー接合技術の開発
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- Material Type
- 記事
- Author/Editor
- 守田 俊章保田 雄亮井出 英一 他
- Alternative Title
- Development of lead free bonding technique corresponding to high temperature environment using micro-scaled silver-oxide particles
- Periodical title
- まてりあ = Materia Japan
- No. or year of volume/issue
- 49(1) 2010.1
- Volume
- 49
- Issue
- 1
- Pages
- 20～22