Qualification of Underfills,Fluxes and Solder Resist for Flip Chip Applications
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- Material Type
- 記事
- Author/Editor
- Aulis TuominenVille LehtinenEero Ristolainen
- Author Heading
- Alternative Title
- フリップチップのためのアンダーフィル,フラックスおよびソルダーレジストの条件
- Periodical title
- 電気化学および工業物理化学 = Denki kagaku
- No. or year of volume/issue
- 67(8) 1999.08
- Volume
- 67
- Issue
- 8
- Pages
- 850～854