プリント配線板用エポキシ樹脂の動向 (特集・プリント配線板材料の動向)

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プリント配線板用エポキシ樹脂の動向

(特集・プリント配線板材料の動向)

Call No. (NDL)
Z74-B258
Bibliographic ID of National Diet Library
5691127
Material type
記事
Author
吉沢 正和
Publisher
東京 : エレクトロニクス実装学会
Publication date
2001-03
Material Format
Paper
Journal name
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 4(2) (通号 22) 2001.3
Publication Page
p.102~107
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Paper

Material Type
記事
Author/Editor
吉沢 正和
Author Heading
Periodical title
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue
4(2) (通号 22) 2001.3
Volume
4
Issue
2
Sequential issue number
22