A New Plasma Process for Surface Treatment prior to Wire Bonding that Utilizes the Sublimation Effect of Alkyl Group Radicals

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A New Plasma Process for Surface Treatment prior to Wire Bonding that Utilizes the Sublimation Effect of Alkyl Group Radicals

Call No. (NDL)
Z53-A375
Bibliographic ID of National Diet Library
6753134
Material type
記事
Author
Kazuhiro Honshoほか
Publisher
Tokyo : Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physics
Publication date
2003-11
Material Format
Digital
Journal name
Japanese journal of applied physics. Part. 1, Regular papers, brief communications & review papers : JJAP 42(11) (通号 585) 2003.11
Publication Page
p.7112~7115
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Detailed bibliographic record

Summary, etc.:

Conventionally, argon plasma has been used as a method of improving wire bonding performance by removing contaminants (nickel, nickel oxides, and impu...

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Bibliographic Record

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Digital

Material Type
記事
Author/Editor
Kazuhiro Honsho
Hirokazu Terai
Hiroshi Yamazoe 他
Periodical title
Japanese journal of applied physics. Part. 1, Regular papers, brief communications & review papers : JJAP
No. or year of volume/issue
42(11) (通号 585) 2003.11
Volume
42
Issue
11
Sequential issue number
585
Pages
7112~7115