超高圧マイクロジェットによる半導体CMPパッドの洗浄・コンディショニング技術

Icons representing 記事

超高圧マイクロジェットによる半導体CMPパッドの洗浄・コンディショニング技術

Call No. (NDL)
Z16-1147
Bibliographic ID of National Diet Library
8717665
Material type
記事
Author
清家 善之ほか
Publisher
東京 : 砥粒加工学会
Publication date
2007-03
Material Format
Paper
Journal name
Abrasive technology : 砥粒加工学会誌 : journal of the Japan Society for Abrasive Technology 51(3) (通号 295) 2007.3
Publication Page
p.134~137
View All

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

  • CiNii Research

    Search Service
    You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Paper

Material Type
記事
Author/Editor
清家 善之
甘利 昌彦
宮地 計二 他
Alternative Title
CMP pad cleaning and conditioning technology for the semiconductor manufacturing with super high-pressure micro jet (HPMJ)
Periodical title
Abrasive technology : 砥粒加工学会誌 : journal of the Japan Society for Abrasive Technology
No. or year of volume/issue
51(3) (通号 295) 2007.3
Volume
51
Issue
3
Sequential issue number
295