残廃材を原料とした建築用バインダレス小片断熱パネル(第5報)スギ樹皮小片パネルの熱伝導率と耐落下衝撃性
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- Material Type
- 記事
- Author/Editor
- 関野 登山内 剛
- Alternative Title
- Binder-less wood chip insulation panel for building use made from wood processing residues and wastes (5) Thermal conductivity and drop impact resistance of sugi bark chip panels
- Periodical title
- 木材学会誌 = Journal of the Japan Wood Research Society
- No. or year of volume/issue
- 53(2) (通号 478) 2007
- Volume
- 53
- Issue
- 2
- Sequential issue number
- 478