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銅スパッタ薄膜内部の...

銅スパッタ薄膜内部の残留応力分布のX線測定 (特集 X線材料強度)

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銅スパッタ薄膜内部の残留応力分布のX線測定(特集 X線材料強度)

Call No. (NDL)
Z14-267
Bibliographic ID of National Diet Library
10384278
Material type
記事
Author
秋庭 義明ほか
Publisher
京都 : 日本材料学会
Publication date
2009-07
Material Format
Paper
Journal name
材料 / 日本材料学会 [編] 58(7) 2009.7
Publication Page
p.575~580
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Paper Digital

Material Type
記事
Author/Editor
秋庭 義明
木村 英彦
坂上 卓
Alternative Title
Measurement of residual stress distribution in sputtered Cu thin films by X-ray method
Periodical title
材料 / 日本材料学会 [編]
No. or year of volume/issue
58(7) 2009.7
Volume
58
Issue
7